Method and apparatus for fracturing polygons on masks used...

Details Method and apparatus for fracturing polygons on masks used... Method and apparatus for fracturing polygons on masks used...

2005-05-03

2005-05-03

Young, Christopher G. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C430S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06887630

ABSTRACT:
A system for fracturing polygons on masks used in lithography processes for manufacturing an integrated circuit is described. The system fractures polygons that include cavities in either the horizontal edges or the vertical edges by examining the aspect ratio (length/width) of prospective slices made at each vertex of the polygon. After determining the aspect ratio of each prospective slice, the system selects the slice with the lowest aspect ratio and slices the polygon into two sub-polygons. Slicing the polygon in this manner effectively eliminates “slivers” or slices with extreme aspect ratios. This process is continued until each sub-polygon is either a rectangle or a trapezoid that can be printed by electron beam photolithography.

REFERENCES:
patent: 5885734 (1999-03-01), Pierrat et al.
patent: 5943487 (1999-08-01), Messerman et al.
patent: 6470489 (2002-10-01), Chang et al.

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