Method and apparatus for forming multi-level features in an obje

Metal deforming – With cutting – By composite tool

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Details

723792, 29 61, 291636, B21D 2810

Patent

active

053926293

ABSTRACT:
An elevated card guide is integrally formed in a card cage in a process using a press, a sheet of raw material, and a tool for forming a plurality of features having at least three levels. In one embodiment, the card guide includes several multi-level bridges with at least three levels in each bridge. In another embodiment, a lead-in is formed in at least one end of at least one horizontal bridge in the multi-level bridges. Still another embodiment incorporates at least one landing in at least one of the horizontal bridges. Lead-ins and landings may also be incorporated into one or more multi-level bridges. The tool includes a male portion and a female portion which cooperate simultaneously. The tool is able to accurately dimension a part in total compliance with required specifications and all printed circuit board designs. A method of forming a plurality of multi-level features uses the press, the sheet, and the tool to form complete features in a single stroke step using the single tool. Activating the press energizes a ram which presses the tool simultaneously into the sheet. After the ram is retracted, the sheet is relocated to another pre-established position which allows room on the card guide for associated components to be connected to the guide. The process is then repeated as necessary. The apparatus and method are readily adapted to many devices of different designs.

REFERENCES:
patent: 132386 (1872-10-01), Coover
patent: 493791 (1893-03-01), Schurig
patent: 1837720 (1931-12-01), Luce
patent: 3287873 (1966-11-01), McDill
patent: 4444037 (1984-04-01), Norgate
patent: 4510786 (1985-04-01), Strangward
patent: 4748841 (1988-06-01), Mezger
Institute of Electrical and Electronics Engineers, Inc. "IEEE Standard for Mechanical Core Specifications for Microcomputers Using IEC 603-2 Connectors", IEEE Std 1101.1-1991 pp. 44-45 (Jun. 18, 1992).

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