Communications – electrical: acoustic wave systems and devices – Borehole testing
Patent
1997-09-19
1999-12-14
Gordon, Paul P.
Communications, electrical: acoustic wave systems and devices
Borehole testing
700106, 700114, 700121, 3955001, 29703, G05B 194097, H05K 1304
Patent
active
060026502
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method and apparatus for preparing mounting data, as well as a storage medium used therefor, which makes it possible to form mounting data needed for automatic mounting mainly of electronic components onto a board with a mounter without manual input of component data needed for each component.
The present invention also relates to a component mounting method and apparatus for automatically mounting mainly electronic components to boards by a mounter.
BACKGROUND ART
There are many kinds of electronic components to be mounted to boards to produce various types of electronic circuit boards, some of which are replaceable with other kinds of components. The total number of kinds of electronic components is furthermore increased if compatible components among different manufacturers are included. In forming an electronic circuit board by mounting electronic components of various kinds to a board, it is necessary to select electronic components that meet various kinds of needs set in the design stage of the electronic circuit. In mounting the various kinds of components on boards, it is also necessary to that the mounting considerations not be mutually influenced by characteristics and durabilities of the electronic components to be mounted and other electronic components. A growing requirement these days is to correctly recognize shapes of components and highly accurately mount the components as a lead pitch is minimized in accordance with an increased density of components.
More specifically, the following factors should be taken into consideration when the electronic components are mounted to the board: the kind of nozzles and chucks for carrying the electronic components, a moving speed of a mounting head equipped with the nozzles and chucks, necessary fall positions of the nozzles and chucks when taking out the electronic components from a component supply section or mounting the components, that is, heightwise positions when the nozzles and chucks take out the electronic components or heightwise positions when the nozzles and chucks mount the electronic components to the board, a moving speed of the board which has at least one electronic component mounted thereon, particularly, an acceleration of the board and various kinds of allowances, etc.
These various kinds of electronic components are packed in tapes to be automatically supplied to the mounter or contained in trays, or handled in the form of sticks or in bulk. This component supply fashion or manner including an accommodation pitch or the like of components, i.e., packing forms of components should also be taken in mind when mounting data are to be formed.
Meanwhile, when the electronic components are mounted, whether or not the electronic components are properly selected or directed is recognized, so that improper components are exchanged or the direction of the components is corrected based on the recognition results. In order to achieve the above inspection, it is necessary to form inspection data, as the mounting data, on the basis of information related to the electronic components such as shapes, surface reflectivities, colors, hue, polarity marks, printed characters, and color codes marked on the components, etc.
Component catalog brochures have been used heretofore to form the above-described mounting data or inspection data and properly mount the selected components on boards so as to select electronic components of various kinds in conformity with the needs from the viewpoint of the circuit design and mount the selected electronic components properly. Detailed and complicated component information is edited and recorded for every kind of electronic component in the brochures according to a predetermined classification method. In some cases, electronic components have been actually measured with the use of calipers or the like to obtain necessary data.
It is difficult not only to actually measure the electronic components as above, but to search for the electronic components meeting the
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Kuribayashi Takeshi
Maenishi Yasuhiro
Nakamura Nobuyuki
Nishida Hiroyoshi
Gordon Paul P.
Matsushita Electric Co., Ltd.
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