Method and apparatus for forming modular sockets using...

Details Method and apparatus for forming modular sockets using... Method and apparatus for forming modular sockets using...

2006-12-26

2006-12-26

Duverne, J. F. (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

07153164

ABSTRACT:
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

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IBM Journal of Research & Development vol. 41, No. ½ Optical lithography, “Negative Photoresists for Optical Lithography” Oct. 16, 1997.

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