Method and apparatus for forming metal contacts on a substrate

Details Method and apparatus for forming metal contacts on a substrate Method and apparatus for forming metal contacts on a substrate

2007-01-02

2007-01-02

Mackey, James P. (Department: 1722)

Static molds

Including electric heating means

C249S115000, C249S119000

Reexamination Certificate

active

11246515

ABSTRACT:
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed into precisely controlled ball shapes and geometries.

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