Method and apparatus for forming electrode on electronic compone

Details Method and apparatus for forming electrode on electronic compone Method and apparatus for forming electrode on electronic compone

1989-12-19

1992-02-25

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118 50, C23C 2600

Patent

active

050912127

ABSTRACT:
Disclosed herein is a method of forming strip-shaped electrodes over an end surface of a plate-shaped electronic component and two major surfaces which are in series with the end surface. A slit plate, which is provided with through slits having width corresponding to the width of electrodes to be formed, is located above an electrode paste bath while an electronic component is arranged above the slit plate so that its end surface extends across the through slits. Before or after this step, the electrodes paste is made to swell to a constant level beyond the upper surface of the slit plate, thereby applying the electrode paste to the end surface of the electronic component and the two major surfaces which are in series with the end surface in the form of strips.

REFERENCES:
patent: 3576669 (1971-04-01), Filip
patent: 3690943 (1972-09-01), Papiano
patent: 4558388 (1985-12-01), Graves
patent: 4655162 (1987-04-01), Kameyama
patent: 4749421 (1988-06-01), Matsui et al.
patent: 4767643 (1988-08-01), Westervelt

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