Method and apparatus for forming double-layer hollow film

Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting – Controlling fluid pressure in direct contact with molding...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264 406, 264514, 264557, 264559, 264560, 264565, 264566, 264569, 264178R, 264180, 425 71, 425 72R, 4253261, B29D 720

Patent

active

043081924

ABSTRACT:
A molten thermoplastic resin is extruded in the form of a double-layer cylindrical hollow film with the two film layers being interconnected with each other by a number of spaced legs and is then immediately passed through an annular gap defined by annular side walls of inner and outer vessels in such a manner that the two film layers are in contact with the respective side walls defining the gap. Coolant is supplied to the inner and outer vessels and overflows above the side walls to bring the coolant into contact with the resin. The level of the coolant overflowing above both side walls is adjusted to be equal and also to have a liquid pressure on the extruded resin balanced with a gas pressure supplied in between the two film layers and the legs of the extruded resin.

REFERENCES:
patent: 3193547 (1965-07-01), Schott, Jr.
patent: 3655846 (1972-04-01), Kanoh et al.
patent: 3812230 (1974-05-01), Takahashi
patent: 3825641 (1974-07-01), Barnett
patent: 4003973 (1977-01-01), Kurokawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for forming double-layer hollow film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for forming double-layer hollow film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for forming double-layer hollow film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1017950

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.