Method and apparatus for forming disilane

Details Method and apparatus for forming disilane Method and apparatus for forming disilane

1984-12-28

1986-02-04

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204165, 427 39, 42218621, 31511121, C07G 1300, H01L 4500

Patent

active

045684375

ABSTRACT:
A method for forming disilane comprises flowing monosilane gas into a reaction vessel while maintaining a glow discharge in the monosilane and flowing the reaction product comprising the disilane out of the reaction vessel at a rate such that the monosilane gas resonance time in the reaction vessel is less than about one second. An apparatus for forming disilane comprises a source of flowing monosilane, a reaction vessel and electrical means for maintaining a glow discharge in the flowing monosilane in the reaction vessel.

REFERENCES:
patent: 3280018 (1966-10-01), Denis
patent: 4064521 (1977-12-01), Carlson
patent: 4066527 (1978-01-01), Takagi
patent: 4289797 (1981-09-01), Akselrad
patent: 4362632 (1982-12-01), Jacob
patent: 4450185 (1984-05-01), Shimizu et al.
patent: 4483883 (1984-11-01), Nath
Spanier et al., Journal of Inorganic Chemistry 1, 432, (1962).
Gorkale et al., Journal of Inorganic Nuclear Chemistry 27, 1911, (1965).
B. Chapman, Glow Discharge Processes, John Wiley & Sons, (New York, 1980), pp. 13-19.
P. A. Longeway et al., J. Physical Chemistry 88, 73-77, (1984).
G. Turban et al., Thin Solid Films 77, 287-300, (1981).
Kirk-Othmer, Encyclopedia of Chemical Technology, John Wiley & Sons, (New York, 1967), pp. 421-427.

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