Method and apparatus for forming compact bodies from conductive

Details Method and apparatus for forming compact bodies from conductive Method and apparatus for forming compact bodies from conductive

1980-03-27

1982-04-20

Hunt, Brooks H.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

75226, 425 78, B22F 314

Patent

active

043257348

ABSTRACT:
Compact bodies for use as contacts in vacuum current interrupters, plasma devices and the like are formed by a vacuum hot press fabrication of suitable powder material. The contacts which may be formed as a button or ring, are operable under high current arcing conditions. The powder material is mixed and placed between a pair of rams in a floating die cavity maintained in an inert atmosphere and is placed in a vacuum chamber. A vacuum is created without pressurizing the powder material. The powder material is heated to below its melting temperature for degassing. The die cavity preferably includes special outgassing ports. The rams are pressurized and the powder material reaches a sintering temperature and a vacuum of 3.times.10.sup.-6 torr. A uniform composition compact body essentially devoid of trapped gas and particularly suitable for use as a high current interrupting contact in an arcing environment results. Interrupter contacts of copper with hundreds of ppm of oxygen (cupric or cuprous) may be formed. Powder material of a non-carbide-forming metal or alloy may be mechanically bonded to a porous graphite element as a result of the process. A weak joint between the powder material, and a porous graphite element may also be created by interposing an anti-bonding graphite powder layer therebetween.

REFERENCES:
patent: 3929476 (1975-12-01), Kirby, Jr. et al.
patent: 4032337 (1977-06-01), Boyer
patent: 4104061 (1978-08-01), Roberts
Hirschhorn Introduction to Powders Metallurgy 1969 pp. 246, 247.

Affiliated with

Also associated with

Rating

Method and apparatus for forming compact bodies from conductive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for forming compact bodies from conductive , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for forming compact bodies from conductive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1262082