Method and apparatus for forming bump

Details Method and apparatus for forming bump Method and apparatus for forming bump

1992-02-24

1993-08-24

Heinrich, Samuel M.

Metal fusion bonding

Process

Applying or distributing fused filler

228 33, 228254, 118410, 118415, 427123, B23K 3102

Patent

active

052381765

ABSTRACT:
A bump having a shape adapted to bonding of a flip chip method and an enough volume is efficiently accurately formed at low costs. By applying a pressure into a chamber, a fused solder 8 in the chamber 1 is extruded from a micro opening 3 and adhered onto a pad 12. After that, by eliminating the pressure, the fused solder is separated by the surface tension of the fused solder itself and is allowed to remain as a solder bump onto the pad.

REFERENCES:
patent: 3603286 (1971-09-01), Scopp et al.
patent: 3810779 (1974-05-01), Pickett et al.
patent: 5133120 (1992-07-01), Kawakami et al.
"Molten Solder Devices," Research Disclosure, Jun. 1988, No. 290.

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