Electric heating – Heating devices – Combined with pressure application means
Reexamination Certificate
2005-04-26
2005-04-26
Bennett, Henry (Department: 3742)
Electric heating
Heating devices
Combined with pressure application means
C148S698000, C266S114000
Reexamination Certificate
active
06884966
ABSTRACT:
There are provided an apparatus and an associated method for manufacturing superplastically formed structural assemblies from preforms. The apparatus includes first and second co-operable dies structured to define a die cavity therebetween for at least partially receiving the preform, at least one heater in thermal communication with the die cavity for heating the preform to a forming temperature, and at least one injector in fluid communication with the die cavity. The injector is structured for injecting pressurized gas into the die cavity to urge the preform against one of the dies to form the preform into the structural assembly. Further, at least one of the injectors is structured for injecting a quenchant into the die cavity to thereby heat treat the structural assembly while distortion of the structural assembly is being at least partially restrained by at least one of the dies.
REFERENCES:
patent: 3753798 (1973-08-01), Komatsu et al.
patent: 4142923 (1979-03-01), Satava
patent: 4394194 (1983-07-01), Satava et al.
patent: 4599502 (1986-07-01), Khare et al.
patent: 4658362 (1987-04-01), Bhatt
patent: 4713953 (1987-12-01), Yavari
patent: 4811890 (1989-03-01), Dowling et al.
patent: 4820355 (1989-04-01), Bampton
patent: 4861391 (1989-08-01), Rioja et al.
patent: 4956008 (1990-09-01), McQuilkin
patent: 5025974 (1991-06-01), Strickland
patent: 5115963 (1992-05-01), Yasui
patent: 5181969 (1993-01-01), Komatsubara et al.
patent: 5263638 (1993-11-01), Douglas
patent: 5277045 (1994-01-01), Mahoney et al.
patent: 5289965 (1994-03-01), Yasui et al.
patent: 5309747 (1994-05-01), Yasui
patent: 5410132 (1995-04-01), Gregg et al.
patent: 5419170 (1995-05-01), Sanders et al.
patent: 5419791 (1995-05-01), Folmer
patent: 5420400 (1995-05-01), Matsen
patent: 5467626 (1995-11-01), Sanders
patent: 5530227 (1996-06-01), Matsen et al.
patent: 5556565 (1996-09-01), Kirkwood et al.
patent: 5603449 (1997-02-01), Mansbridge et al.
patent: 5638724 (1997-06-01), Sanders
patent: 5645744 (1997-07-01), Matsen et al.
patent: 5661992 (1997-09-01), Sanders
patent: 5683607 (1997-11-01), Gillespie et al.
patent: 5683608 (1997-11-01), Matsen et al.
patent: 5700995 (1997-12-01), Matsen
patent: 5705794 (1998-01-01), Gillespie et al.
patent: 5728309 (1998-03-01), Matsen et al.
patent: 5737954 (1998-04-01), Yasui
patent: 5808281 (1998-09-01), Matsen et al.
patent: 5823032 (1998-10-01), Fischer
patent: 5829716 (1998-11-01), Kirkwood et al.
patent: 5914064 (1999-06-01), Gillespie et al.
patent: 6129261 (2000-10-01), Sanders
patent: 6264767 (2001-07-01), Frank et al.
patent: 6299706 (2001-10-01), Miyake et al.
patent: 6322645 (2001-11-01), Dykstra et al.
patent: 6337471 (2002-01-01), Kistner et al.
patent: 6568582 (2003-05-01), Colligan
patent: 6659331 (2003-12-01), Thach et al.
patent: 20020139161 (2002-10-01), Gates
patent: 20030218052 (2003-11-01), Litwinski
Coleman Gary W.
Fischer John R.
Matsen Marc R.
Mull Elizabeth M.
Nansen David S.
Alston & Bird LLP
Bennett Henry
Fastovsky Leonid M
The Boeing Company
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