Method and apparatus for forming a uniform solder wave

Details Method and apparatus for forming a uniform solder wave Method and apparatus for forming a uniform solder wave

1977-06-30

1978-02-07

Kaplan, Morris

Coating processes

Immersion or partial immersion

Molten metal or fused salt bath

118 63, 118425, 118429, 228 37, B05D 118, B05C 310

Patent

active

040727777

ABSTRACT:
A tapered array of apertures are provided in a wall of a solder pot to permit passage of molten solder therethrough. Molten solder is pumped along an outside channel, perpendicular to the axes of the apertures, and through the apertures to cause the solder pot to overflow with a uniformly distributed wave. The array tapers in the direction of pumped fluid flow.

REFERENCES:
patent: 3119363 (1964-01-01), Rieben
patent: 3135630 (1964-06-01), Bielinski et al.
patent: 3196829 (1965-07-01), Elliott et al.
patent: 3217959 (1965-11-01), Renzo
patent: 3398873 (1968-08-01), Wegener et al.
patent: 3500536 (1970-03-01), Goldschmied
patent: 3565319 (1971-02-01), Eschenbrucher
patent: 3941088 (1976-03-01), Renafoldi et al.

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