Method and apparatus for forming a laminate

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156580, B29C 6548, B32B 3108, B32B 3120

Patent

active

058513426

ABSTRACT:
An apparatus and a method for bonding a laminate formed of at least two layers of sheet material superimposed on one another with adhesive therebetween and moved along a path. The apparatus includes a first laminator having an upper plate assembly having a first low-friction laminate-contacting surface for contacting a first layer of the laminate, and an upper heat exchanger thermally coupled to the upper plate assembly. The first laminator also includes a lower plate assembly having a second low-friction laminate-contacting surface for contacting a second layer of the laminate, wherein the first and second laminate-contacting surfaces are disposed in opposed relationship for accommodating passage of the layers of the laminate therebetween, and a lower heat exchanger thermally coupled to the lower plate assembly. The first laminator further includes a drive member coupled to at least one of the laminate-contacting surfaces for varying the distance between the surfaces to apply pressure to the layers of the laminate. The apparatus may also include a second laminator downstream of the first laminator and substantially identical to the first laminator. The heat exchangers of the first and second laminators can both be used for heating or cooling, or one for cooling and one for heating, depending upon the application.

REFERENCES:
patent: 3096145 (1963-07-01), Carnaut
patent: 3223027 (1965-12-01), Soda et al.
patent: 4353776 (1982-10-01), Giulie et al.
patent: 4466857 (1984-08-01), Pfeiffer
patent: 4609100 (1986-09-01), Fudickar et al.
patent: 4670080 (1987-06-01), Schwarz et al.
patent: 4909886 (1990-03-01), Noguchi
patent: 4927479 (1990-05-01), Bock
patent: 4997507 (1991-03-01), Meyer
patent: 5087319 (1992-02-01), Held
patent: 5158641 (1992-10-01), Vermeulen et al.
patent: 5378304 (1995-01-01), Denker
patent: 5437760 (1995-08-01), Benkowski et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for forming a laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for forming a laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for forming a laminate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2042209

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.