Method and apparatus for forming a film by sputtering process

Details Method and apparatus for forming a film by sputtering process Method and apparatus for forming a film by sputtering process

1995-06-07

2000-01-18

Nguyen, Nam

Coating processes

With post-treatment of coating or coating material

Cooling

20419212, 20429806, 20429809, 20429811, 427294, 427314, 118723R, 118724, B05D 300, C23C 1434

Patent

active

060155949

ABSTRACT:
A film-forming method and apparatus for forming a deposited film on a substrate employing plasma generated by a raw material gas for film formation in a film-forming chamber involves several steps. The method includes arranging a deposition preventive member in the film-forming chamber so that the deposition preventive member prevents a film from being deposited on an inner wall of the chamber during film formation. A heater and a cooler are alternately arranged on a face of the deposition preventive member. Prior to commencing film deposition, the deposition preventive member is heated using the heater. During film formation, the deposition preventive member is cooled by the cooler to prevent the deposition preventive member from releasing contaminants.

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