Method and apparatus for forming a DMD window frame with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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C438S124000, C438S127000, C257SE23118, C257SE23124

Reexamination Certificate

active

10200684

ABSTRACT:
An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.

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patent: 2003/0101562 (2003-06-01), Hanna et al.
U.S. Appl. No. 10/143,232, Haskett.

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