Method and apparatus for forming a ball in wire bonding

Details Method and apparatus for forming a ball in wire bonding Method and apparatus for forming a ball in wire bonding

1997-10-17

1999-09-28

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 45, 219 5621, 219 5622, H01L 2160

Patent

active

059573716

ABSTRACT:
In a fixed type discharge electrode system employed for forming a ball on a bonding wire, a magnet is provided on, for instance, the discharge electrode so as to apply a magnetic field that causes the portion of an electric spark facing the bonding wire to be bent and positioned beneath the bonding wire.

REFERENCES:
patent: 4594493 (1986-06-01), Harrah et al.
patent: 5263631 (1993-11-01), Felber

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