Method and apparatus for fluxless solder reflow

Details Method and apparatus for fluxless solder reflow Method and apparatus for fluxless solder reflow

1990-06-12

1992-11-17

Albritton, C. L.

Electric heating

Metal heating

By arc

B23K 2600

Patent

active

051645661

ABSTRACT:
A method for reflowing solder without flux includes the steps of placing a first metallic element in contact with a second, solder-plated element, thereby defining a bond site; and causing a laser beam to impinge on the bond site. An apparatus for performing the above method is also disclosed.

REFERENCES:
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patent: 4587395 (1986-05-01), Oakley et al.
patent: 4700044 (1987-10-01), Hokanjon et al.
patent: 4893742 (1990-01-01), Bullock
patent: 4926022 (1990-05-01), Freedman
The Handbook of Machine Soldering (2nd ed. 1988) Ralph W. Woodgate.
Solders and Soldering (2nd ed. 1979) Howard Manko.
R. K., "Cost Effective Packaging is Target at MCC," Electronic Packaging & Production, pp. 13-14, Apr. 1988.
DeVore et al., "To Solder Easily," Circuits Manufacturing, pp. 63-65 and 70, Jun. 1984.
"Tech Briefs," Laser Focus/Electro-Optics, pp. 42, Jul. 1987.
Miller, "Soldering With Light," Photonics Spectra, pp. 83-36, May, 1983.
Lea, "Laser Soldering--Production and Microstructural Benefits of SMT," Soldering and Surface Mounting Technology, No. 2, Jun. 1989, pp. 13-21.

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