Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1990-05-16
1993-04-27
Rowan, Kurt C.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
B23K 112
Patent
active
052054616
ABSTRACT:
Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
REFERENCES:
patent: 4552300 (1985-11-01), Zovko et al.
patent: 4899920 (1990-02-01), Abbagnaro et al.
Bickford Harry R.
Horton Raymond R.
Noyan Ismail C.
Palmer Michael J.
Zyzo John C.
International Business Machines - Corporation
Morris Daniel P.
Rowan Kurt C.
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