Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1988-07-29
1990-06-26
Rowan, Kurt
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228 20, B23K 112
Patent
active
049370065
ABSTRACT:
Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.
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Bickford Harry R.
Horton Raymond R.
Novan Ismail C.
Palmer Michael J.
Zyzo John C.
International Business Machines - Corporation
Morris Daniel P.
Rowan Kurt
LandOfFree
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