Method and apparatus for fluxing and soldering terminals on a pr

Details Method and apparatus for fluxing and soldering terminals on a pr Method and apparatus for fluxing and soldering terminals on a pr

1994-11-21

1995-11-21

Rowan, Kurt

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281801, 228223, 228 37, B23K 120, B23K 3102

Patent

active

054679141

ABSTRACT:
Fluxing and soldering terminals on a printed circuit board in an in-line process in which a wall of flux is directed against a surface of the board which moves in inclined manner as it passes through a fluxing station and towards a soldering station. The process controls flux application to decrease the amount of flux applied from the leading end to the trailing end of the board, the board inclination resulting in flow of flux to redistribute it towards providing a constant flux thickness for the soldering step. Particularly useful for processes involving "no-clean" flux application where residual flux after soldering is to be avoided because of potential electrical problems.

REFERENCES:
patent: 3112723 (1963-12-01), Potocki
patent: 4871105 (1989-10-01), Fisher et al.

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