Method and apparatus for fluxing and soldering terminals on a pr

Details Method and apparatus for fluxing and soldering terminals on a pr Method and apparatus for fluxing and soldering terminals on a pr

1994-11-21

1995-12-19

Bradley, P. Austin

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281801, 228223, 228 37, B23K 3102, B23K 3112

Patent

active

054762073

ABSTRACT:
Fluxing and soldering terminals on a printed circuit board by an in-line process in which flux concentration is determined at specific locations laterally of the passline. At each of the positions infrared light is passed through a wall of flux which is being directed at the board. The infrared light becomes partly absorbed by materials in the flux and the unabsorbed light which passes through the wall of flux is used to generate signals corresponding to the different wavelengths of unabsorbed light at each of the locations. This enables a determination to be made of the flux concentration at each location. The signals are preferably used to effect a change in the flow rate of flux at any specific location so as to control the amount of flux deposited upon the board. Particularly useful for "no-clean" flux applications.

REFERENCES:
patent: 4890781 (1990-01-01), Johnson et al.
patent: 5238171 (1993-08-01), Takahashi
patent: 5332145 (1994-07-01), Bell et al.

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