Method and apparatus for flip chip device assembly by...

Details Method and apparatus for flip chip device assembly by... Method and apparatus for flip chip device assembly by...

2006-06-06

2006-06-06

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S111000, C438S112000, C438S118000, C438S613000, C228S180220

Reexamination Certificate

active

07056767

ABSTRACT:
A flip chip semiconductor device having non-solder contact terminals is assembled by securing the chip and substrate with a rapidly thermosetting adhesive. The process is amenable to various bump and substrate materials, and has the advantage of simultaneously adhering the components and of providing a void free underfill. The process makes use of absorption of infrared energy by the chip to heat the adhesive and cause it to flow prior to rapidly solidifying from the center outwardly. The rapid assembly, using a simple infrared exposure apparatus is compatible with reel to reel, or other highly automated in-line processes.

REFERENCES:
patent: 4645116 (1987-02-01), Henein et al.
patent: 5060288 (1991-10-01), Spigarelli et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5438165 (1995-08-01), Fritz
patent: 5438749 (1995-08-01), Runyon
patent: 5482200 (1996-01-01), Myers et al.
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5861678 (1999-01-01), Schrock
patent: 6046076 (2000-04-01), Mitchell et al.
patent: 6063139 (2000-05-01), Fukaya
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6200830 (2001-03-01), Ito et al.
patent: 6221691 (2001-04-01), Schrock
patent: 6235555 (2001-05-01), Cho
patent: 6395124 (2002-05-01), Oxman et al.
patent: 6485301 (2002-11-01), Gemunder et al.
patent: 6555414 (2003-04-01), Vanfleteren et al.
patent: 6692611 (2004-02-01), Oxman et al.
patent: 6858469 (2005-02-01), Schrock
patent: 6914196 (2005-07-01), Cho
patent: 2002/0027294 (2002-03-01), Neuhaus et al.
patent: 2002/0079594 (2002-06-01), Sakurai
patent: 2003/0097748 (2003-05-01), How et al.

Affiliated with

Also associated with

Rating

Method and apparatus for flip chip device assembly by... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for flip chip device assembly by..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for flip chip device assembly by... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3644503