Method and apparatus for flip-chip bonding

Details Method and apparatus for flip-chip bonding Method and apparatus for flip-chip bonding

2008-10-08

2010-10-19

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21499

Reexamination Certificate

active

07816179

ABSTRACT:
Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.

REFERENCES:
patent: 3735911 (1973-05-01), Ward
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5500502 (1996-03-01), Horita et al.
patent: 6394158 (2002-05-01), Momeni
patent: 6464126 (2002-10-01), Hayata et al.
patent: 6849825 (2005-02-01), Tanaka
patent: 62-291934 (1987-12-01), None
patent: 03-264159 (1991-11-01), None
patent: 2002-141376 (2002-05-01), None
Patent Abstracts of Japan, english translation, JP 03-264159, Nov. 25, 1991.
Patent Abstracts of Japan, english translation, JP 62-291934, Dec. 18, 1987.

Affiliated with

Also associated with

Rating

Method and apparatus for flip-chip bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for flip-chip bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for flip-chip bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4241092