Method and apparatus for flip-chip bonding

Metal fusion bonding – With means to juxtapose and bond plural workpieces

Reexamination Certificate

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C156S349000

Reexamination Certificate

active

07464850

ABSTRACT:
Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.

REFERENCES:
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patent: 4627151 (1986-12-01), Mulholland et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5500502 (1996-03-01), Horita et al.
patent: 6394158 (2002-05-01), Momeni
patent: 6464126 (2002-10-01), Hayata et al.
patent: 2002-141376 (2002-05-01), None

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