Method and apparatus for flip-chip bonding

Details Method and apparatus for flip-chip bonding Method and apparatus for flip-chip bonding

2005-12-01

2008-12-16

Geyer, Scott B (Department: 2812)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

C156S349000

Reexamination Certificate

active

07464850

ABSTRACT:
Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.

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