Method and apparatus for fixturing substrate assemblies for elec

Details Method and apparatus for fixturing substrate assemblies for elec Method and apparatus for fixturing substrate assemblies for elec

1996-09-18

1999-02-16

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

204242, 204297R, 204297W, 269231, 269903, C25D 1706, C25D 502, C25D 700, B25B 108

Patent

active

058716297

ABSTRACT:
A fixture for securing a pin grid array (PGA) and grounding all circuits or pins in the PGA for electrolytic plating provides a series of parallel wires that are inserted between every other gap between the PGA pin rows. The cross section of each wire is constructed to provide a first cross sectional width at one location that is less than or equal to the PGA gap width for insertion into the PGA gap and a second cross sectional width, at an angle to the first cross sectional width, that is greater than the gap width. With this arrangement, the wire can be inserted in the gap with the first cross sectional width traversing the gap and then rotated to bring the wider, second cross sectional width into spreading engagement with the pins for a reliable mechanical and conductive contact.

REFERENCES:
patent: 2137819 (1938-11-01), Wagner
patent: 3502317 (1970-03-01), Killerby et al.
patent: 4152241 (1979-05-01), Warren
patent: 4312716 (1982-01-01), Maschler et al.
patent: 4682765 (1987-07-01), Mainville
patent: 5022976 (1991-06-01), Roll et al.
patent: 5516416 (1996-05-01), Canaperi et al.
patent: 5580432 (1996-12-01), Shibata et al.

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