Method and apparatus for fine pitch wire bonding using a shaved

Details Method and apparatus for fine pitch wire bonding using a shaved Method and apparatus for fine pitch wire bonding using a shaved

1994-10-14

1995-11-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, 228 495, H01L 21603

Patent

active

054658993

ABSTRACT:
An wire bonding apparatus for forming ball and stitch bonds includes a bond head (42) having a shaved capillary (20), a carrier (43) for holding the bond head (42), a bearing (44) on which the carrier (43) is mounted, and a bearing table (46) on which the bearing (44) is mounted. The bearing table (46) and bearing (44) provide rotary movement about a z axis for the capillary (20). An x-y table (48) on which the carrier bearing table (46) is mounted provides movement in x and y directions for the capillary (20). A fixed work holder (50) supports a semiconductor die (11) and a leadframe (52) adjacent the capillary (20). The relative rotation provided between shaved capillary (20) and work holder (50) provides proper orientation of the capillary (20) with respect to leadframe (52) to form high quality stitch bonds on leadframe (52) while permitting fine pitch ball bonds to be formed on the semiconductor die (11).

REFERENCES:
patent: 5269452 (1993-12-01), Sterczyk

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