Abrading – Abrading process – Utilizing fluent abradant
Reexamination Certificate
2005-08-16
2005-08-16
Thomas, David B. (Department: 3723)
Abrading
Abrading process
Utilizing fluent abradant
C451S060000
Reexamination Certificate
active
06929532
ABSTRACT:
A polishing slurry supply circuit for a semiconductor wafer fabrication process includes a tangential flow filter. The tangential flow filter is positioned upstream of a wafer polishing apparatus. The tangential flow filter may take the form of a hollow fiber filters or tubular filtration filters. Such filters may be embodied as either ultrafiltration cartridges or microfiltration cartridges. A method of operating a chemical-mechanical polishing system is also disclosed.
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Barnes & Thornburg
LSI Logic Corporation
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