X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis
Reexamination Certificate
2006-10-31
2006-10-31
Glick, Edward J. (Department: 2882)
X-ray or gamma ray systems or devices
Specific application
Diffraction, reflection, or scattering analysis
C378S070000
Reexamination Certificate
active
07130373
ABSTRACT:
The thickness of a thin film can be measured based on the X-ray diffraction method. An X-ray is allowed to be incident upon a surface of the thin film. An intensity of a diffracted X-ray is measured with the incident angle α being changed to obtain a measured rocking curve. On the other hand, a theoretical rocking curve is calculated in consideration of an orientation density distribution function ρ of the thin film. A scale factor is predetermined for a standard sample having a known film thickness. A parameter fitting operation is carried out in a manner that the characteristic parameter of the function ρ and the film thickness t are adjusted so that the theoretical rocking curve including the scale factor can approach the measured rocking curve as closely as possible.
REFERENCES:
patent: 6873681 (2005-03-01), Toraya et al.
patent: 04-194611 (1992-07-01), None
patent: 10-038821 (1998-02-01), None
patent: 10-103942 (1998-04-01), None
patent: 2000-088776 (2000-03-01), None
H. Toraya et al: “Quantitative basis for the rocking-curve measurement of preferred orientation in polycrystalline thin films”, Journal of Applied Crystallography, ISSN 0021-8898, Feb. 7, 2003, International Union of Chrystallography, Great Britain, 2003; pp. 890-897.
Himeda Akihiro
Omote Kazuhiko
Frishauf Holtz Goodman & Chick P.C.
Glick Edward J.
Rigaku Corporation
Yun Jurie
LandOfFree
Method and apparatus for film thickness measurement does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for film thickness measurement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for film thickness measurement will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3628379