Coating apparatus – Solid applicator contacting work – With work-handling or work-supporting
Reexamination Certificate
2003-11-03
2008-11-11
Wilczewski, M. (Department: 2822)
Coating apparatus
Solid applicator contacting work
With work-handling or work-supporting
C141S270000, C141S284000, C118S256000
Reexamination Certificate
active
07449067
ABSTRACT:
A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.
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Filling the via hole of IC by VPES (Vacuum Printing Encapsulation Systems for stacked chip (3D Packaging), A. Okuno et al., 2002 Electronics Components and Technology Conference.
Andry Paul S.
Casey Jon A.
Horton Raymond R.
Patel Chiraq S.
Sprogis Edmund J.
Aker David
International Business Machines - Corporation
Trepp Robert M.
Wilczewski M.
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