Method and apparatus for filling low aspect ratio cavities...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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Details

C205S104000, C205S123000, C205S205000, C205S239000, C205S291000

Reexamination Certificate

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06858121

ABSTRACT:
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, using an indirect external influence, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion, thus causing greater plating of the cavity portion relative to the top portion.

REFERENCES:
patent: 6004880 (1999-12-01), Liu et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6245676 (2001-06-01), Ueno
patent: 6284121 (2001-09-01), Reid
patent: 6303014 (2001-10-01), Taylor et al.
patent: 6534116 (2003-03-01), Basol
patent: 20020166773 (2002-11-01), Cohen
patent: 1 063 696 (2000-12-01), None
patent: 1 122 989 (2001-08-01), None
patent: 11-238703 (1999-08-01), None
patent: 2001291954 (2001-10-01), None

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