Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2005-02-22
2005-02-22
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S104000, C205S123000, C205S205000, C205S239000, C205S291000
Reexamination Certificate
active
06858121
ABSTRACT:
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, using an indirect external influence, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion, thus causing greater plating of the cavity portion relative to the top portion.
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patent: 2001291954 (2001-10-01), None
NuTool Inc.
NuTool Legal Department
Wong Edna
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