Method and apparatus for filling a gap between spaced layers of

Details Method and apparatus for filling a gap between spaced layers of Method and apparatus for filling a gap between spaced layers of

1997-01-28

1999-02-02

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438126, 438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

058664424

ABSTRACT:
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

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