Package making – Methods – Filling preformed receptacle
Patent
1994-09-14
1996-03-19
Coan, James F.
Package making
Methods
Filling preformed receptacle
53246, 53539, B65B 510
Patent
active
054994870
ABSTRACT:
The reliable population of a ball grid array is achieved by attaching the array to the inner face of a wheel which is rotatable about a central axis. A tooling fixture is attached to the outer face of the wheel. Each of the ball grid array and the tooling fixture has a face with recesses and the faces face one another. The wheel moves the tooling fixture into a reservoir of solder balls to populate the recesses in the tooling fixture and the solder balls are dropped into the corresponding recesses of the ball grid array when the wheel rotates to a position where the recesses in the ball grid array are beneath the recesses in the tooling fixture. The array and the fixture are spaced apart initially so that the rotation of the wheel moves only the fixture through the reservoir ensuring that all recesses in the fixture are filled and that all solder balls not occupying recesses are removed from the surface of the fixture by the force of gravity as the wheel turns. The array and the fixture are moved together for the transfer of the solder balls to the ball grid array.
REFERENCES:
patent: 2613861 (1952-10-01), Goerlitz
patent: 3298404 (1967-01-01), Eisenberg
patent: 3696581 (1972-10-01), Eisenberg
patent: 3789575 (1974-02-01), Bross
patent: 4546594 (1985-10-01), Mohaupt
Coan James F.
Shapiro Herbert M.
Vanguard Automation, Inc.
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