Method and apparatus for filling a ball grid array

Details Method and apparatus for filling a ball grid array Method and apparatus for filling a ball grid array

1995-07-20

1996-09-03

Coan, James F.

Package making

Methods

Filling preformed receptacle

53246, 53539, B65B 510

Patent

active

055512160

ABSTRACT:
A work cell for populating a ball grid array employs gravity for transferring solder balls from a tooling plate to the ball grid array. The tooling plate is positioned on a gantry along with a reservoir for solder balls. The gantry, along with the tooling plate and reservoir, is rotated through about one hundred and eighty degrees to spread the solder balls over the tooling plate and to recapture loose solder balls as the gantry rotates. A riser cylinder moves a ball grid array into juxtaposition with the populated tooling plate prior to the point (i.e. angle of rotation) at which gravity operates to drop the solder balls out of the tooling plate. Further rotation results in gravity transfer of the solder balls to a (fluxed) ball grid array. Apparatus employing more than one work cell is also described.

REFERENCES:
patent: 2613861 (1952-10-01), Goerlitz
patent: 3298404 (1967-01-01), Eisenberg
patent: 3696581 (1972-10-01), Eisenberg
patent: 3789575 (1974-02-01), Bross
patent: 4546594 (1985-10-01), Mohaupt

Affiliated with

Also associated with

Rating

Method and apparatus for filling a ball grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for filling a ball grid array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for filling a ball grid array will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1943983