Method and apparatus for fastening semiconductor components to s

Details Method and apparatus for fastening semiconductor components to s Method and apparatus for fastening semiconductor components to s

1989-03-01

1990-02-27

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using a compliant cushioning medium

228193, 22826312, H01L 2158, B23K 2002

Patent

active

049038869

ABSTRACT:
A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at least 500 kp/cm.sup.2 at a moderate temperature of approximately 150 to 200 degrees C. Components which have a structured or shaped upper side can be joined to substrates when they are inserted in common with a member of elastically deformable material, such as silicone rubber, into a receptacle chamber that is closed by a movable die which transmits the pressing power. The deformable member completely fills out the remaining interior of the receptacle chamber when the pressing power is reached.

REFERENCES:
patent: 3650454 (1972-03-01), Coucoulas
patent: 3670396 (1972-06-01), Lindberg
patent: 3914850 (1975-10-01), Coucoulas
patent: 4444352 (1984-04-01), Glascock
patent: 4810672 (1989-03-01), Schwarzbauer

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