Method and apparatus for fastening electronic components to subs

Details Method and apparatus for fastening electronic components to subs Method and apparatus for fastening electronic components to subs

1989-03-01

1990-02-27

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using a compliant cushioning medium

228193, 228243, 22826312, H01L 2158, B23K 2002

Patent

active

049038850

ABSTRACT:
A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structured upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3669333 (1972-06-01), Coucoulas
patent: 4756752 (1988-07-01), Barnard
patent: 4810672 (1989-03-01), Schwarzbauer

Affiliated with

Also associated with

Rating

Method and apparatus for fastening electronic components to subs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for fastening electronic components to subs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for fastening electronic components to subs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-167853