Method and apparatus for fastening electronic components to subs

Metal fusion bonding – Process – Using a compliant cushioning medium

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228193, 228243, 22826312, H01L 2158, B23K 2002

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active

049038850

ABSTRACT:
A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structured upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

REFERENCES:
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3669333 (1972-06-01), Coucoulas
patent: 4756752 (1988-07-01), Barnard
patent: 4810672 (1989-03-01), Schwarzbauer

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