Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-02-15
2011-02-15
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S107000, C438S109000, C438S118000, C438S613000, C257S685000, C257S686000, C257S777000, C257S778000, C257SE21503, C257SE21514, C257SE23004, C257SE23010
Reexamination Certificate
active
07888175
ABSTRACT:
The described embodiments provide a system that facilitates inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip and a second integrated circuit chip, both of which whose surfaces have corresponding etch pit wells configured to align with each other. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby aligning the first integrated circuit chip with the second integrated circuit chip. In some embodiments the etch pit wells include conductive structures for routing power through a conductive shaped structure.
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R.J. Drost et al., “Proximity communications”, Proc. IEEE Custom Integrated Circuits Conference (CICC-2003), pp. 469-472, Sep. 2003.
Cunningham John E.
Krishnamoorthy Ashok V.
Jones Anthony P.
Nguyen Dao H
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
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