Method and apparatus for facilitating detection of solder opens

Details Method and apparatus for facilitating detection of solder opens Method and apparatus for facilitating detection of solder opens

1996-10-30

1999-10-12

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 3126

Patent

active

059660201

ABSTRACT:
A split-pad land pattern configured to facilitate electrical testing of an interconnection between a single electrical contact of a surface mount technology component and a printed circuit board. The split-pad land pattern comprises at least one split mounting pad including at least a first and second mounting pads coupled to a single electrical contact. The mounting pads are further coupled to corresponding access pads so that a first access pad is coupled to the first mounting pad while a second access pad is coupled to the second mounting pad. Electrical testing of the single electrical contact is possible through the completed circuit between the two access pads.

REFERENCES:
patent: 2918648 (1959-12-01), Ludman et al.
patent: 3016489 (1962-01-01), Briggs et al.
patent: 3528104 (1970-09-01), Ehlschlager
patent: 4056773 (1977-11-01), Sullivan
patent: 4278508 (1981-07-01), White et al.
patent: 4419626 (1983-12-01), Cedrone et al.
patent: 4463310 (1984-07-01), Whitley
patent: 4724383 (1988-02-01), Hart
patent: 4841240 (1989-06-01), Hsue et al.
patent: 5554928 (1996-09-01), Stringer
patent: 5573172 (1996-11-01), Gore
patent: 5625297 (1997-04-01), Arnaudov et al.
patent: 5654646 (1997-08-01), Kit

Affiliated with

Also associated with

Rating

Method and apparatus for facilitating detection of solder opens does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for facilitating detection of solder opens , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for facilitating detection of solder opens will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-656077