Superconductor technology: apparatus – material – process – High temperature devices – systems – apparatus – com- ponents,... – Josephson junction – per se or josephson junction with only...
Patent
1995-02-13
1997-08-12
Kunemund, Robert
Superconductor technology: apparatus, material, process
High temperature devices, systems, apparatus, com- ponents,...
Josephson junction, per se or josephson junction with only...
505234, 505329, 505702, C30B 2502
Patent
active
056565755
ABSTRACT:
The present invention provides a superconducting device having a weak link junction with an angle at the grain boundary between the two superconductor crystals being variable. The angle at the junction is substantially equivalent to a vicinal angle for the substrate. Accordingly, the magnitude of the angle at the junction can be varied by varying the vicinal angle of the substrate. This result can be realized by using buffer layers of different compositions underlying the superconducting materials on either side of the weak link junction. Weak link junctions and reproducible properties are essential for a variety of electronic and magnetic sensing devices.
REFERENCES:
patent: 5157466 (1992-10-01), Char et al.
patent: 5366953 (1994-11-01), Char et al.
patent: 5464812 (1995-11-01), Inada et al.
Sugimoto et al. "Evidence for Step Flow Growth of Bi-Sr-Ca-Cu-0 Thin Films on Vicinal Substrates in", Appl. Phys. Letters, 63(19), 8 Nov. 1993 pp. 2697-2699.
Char et al., "Bi-Epitaxial Grain Boundary Junctions In YBa.sub.2 Cu.sub.3 0.sub.7 ", American Institute of Physics, Appl. Phys. Lett., vol. 59, No. 6, 5 Aug. 1991, pp. 733-735.
Dimos et al., "Orientation of Grain-Boundary Critical Currents In YBa.sub.2 Cu.sub.3 0.sub.7-.delta. Bicrystals", The American Physical Society, Physical Review Letters, vol. 61, No. 2, 11 Jul. 1988, pp. 219-222.
Lowndes et al., "Suppression of the Spiral-Growth Mechanism In Epitaxial YBa.sub.2 Cu.sub.3 0.sub.7-.times. Films Grown on Miscut Substrates", American Institute of Physics, Appl. Phys. Lett. 61, (7), 17 Aug. 1992, pp. 852-854.
Mannhart et al., "High-T.sub.c Thin Films. Growth Modes--Structure--Applications", Invited Presentation at NATO ASI Course on Materials and Crystallographic Aspects of HighT.sub.c Superconductivity, Erice, Italy, May 17-29, 1993, pp. 1-18.
Streiffer et al., "Growth of YBa.sub.2 Cu.sub.3 0.sub.7-.delta. on Vicinally Polished Mg0 Substrates", American Institute of Physics, Appl. Phys. Lett. 57 (23), 3 Dec. 1990, pp. 2501-2503.
Kunemund Robert
Ross P.C. Sheridan
Superconducting Core Technologies, Inc.
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