Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1998-11-16
2000-12-12
Graybill, David E.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438113, 438115, 438123, 438691, H01L 2144, H01L 2148, H01L 2150, H01L 21302, H01L 21461
Patent
active
061597708
ABSTRACT:
There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.
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Fujisaki Fumitoshi
Fukunaga Masao
Itasaka Kenji
Kamifukumoto Terumi
Maki Shinichiro
Fujitsu Limited
Graybill David E.
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