Method and apparatus for fabricating insulative panel

Details Method and apparatus for fabricating insulative panel Method and apparatus for fabricating insulative panel

1980-05-27

1983-11-22

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156213, 156292, 156217, 428 72, 428 76, 428117, B31F 120, B29C 1740, B32B 300

Patent

active

044167156

ABSTRACT:
A press, carried by a first table and having punch and die components, receives a rectangular filler sheet and forms a lateral accordian fold sheet. The accordian fold sheet is lifted from the press by transfer means and placed upon an envelope sheet overlaying a second table. Hinged panels carried by the second table fold the envelope sheet over the accordian fold sheet, forming a rigid compartmentalized panel having an opening along a longitudinal edge. The second table, with the opening upright, moves to a position under a receptacle from which granular loose fill material is entered into the compartments through the opening. Subsequently, flaps extending along the panels move to further fold the envelope sheet and close the opening.

REFERENCES:
patent: 1735877 (1929-11-01), Payne
patent: 1765796 (1930-06-01), Kirschbraun
patent: 2342839 (1944-02-01), Byers
patent: 3526556 (1970-09-01), Berner
patent: 3650871 (1972-03-01), Bentfors
patent: 3857752 (1974-12-01), McCoy
patent: 3886023 (1975-05-01), Deplante
patent: 4057944 (1977-11-01), Wyatt, Jr. et al.
patent: 4070839 (1978-01-01), Clem
patent: 4150186 (1979-04-01), Kazama

Affiliated with

Also associated with

Rating

Method and apparatus for fabricating insulative panel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for fabricating insulative panel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for fabricating insulative panel will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1813641