Method and apparatus for fabricating a plurality of...

Details Method and apparatus for fabricating a plurality of... Method and apparatus for fabricating a plurality of...

2007-03-12

2011-11-15

Tsai, H. Jey (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S123000, C438S124000, C257SE51020

Reexamination Certificate

active

08058098

ABSTRACT:
A method includes the steps of providing a carrier comprising a plurality of cavities; placing at least one semiconductor element into each of the cavities; filling the plurality of cavities with a packaging material; and removing the carrier.

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Mario Engl, et al., “mm-Wave Packaging: A Low-cost Solution based on a Leadless Plastic Package”, 8 pages, date unknown but published prior to filing of present application.
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