Metal working – Plural diverse manufacturing apparatus including means for... – Separate tool stations for selective or successive operation...
Reexamination Certificate
2008-03-04
2008-03-04
Arbes, Carl J. (Department: 3729)
Metal working
Plural diverse manufacturing apparatus including means for...
Separate tool stations for selective or successive operation...
C029S739000, C029S740000, C029S741000
Reexamination Certificate
active
11270317
ABSTRACT:
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method can include the steps of depositing solder on one or more chip modules, placing and interconnecting low-cost components on the chip modules, and storing the preprocessed chip modules in pallets or in a tape and reel. Later these chip carriers may then be mounted on a circuit board, possibly over; for example, low and/or high cost components and then populated with low and/or high cost components. The apparatus includes a unique stackable chip module pallet and print fixture pedestal.
REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 3665256 (1972-05-01), Goun et al.
patent: 3737986 (1973-06-01), Cranston
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4038488 (1977-07-01), Lin
patent: 4245877 (1981-01-01), Auriana
patent: 4288841 (1981-09-01), Gogal
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4398235 (1983-08-01), Lutz et al.
patent: 4437235 (1984-03-01), McIver
patent: 4549200 (1985-10-01), Ecker et al.
patent: 4616655 (1986-10-01), Weinberg et al.
patent: 4632293 (1986-12-01), Feinstein
patent: 4763188 (1988-08-01), Johnson
patent: 4802062 (1989-01-01), Blum et al.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5107586 (1992-04-01), Eichelberger et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5130894 (1992-07-01), Miller
patent: 5191404 (1993-03-01), Wu et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5239447 (1993-08-01), Cotues et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5299094 (1994-03-01), Nishino et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5311407 (1994-05-01), Lumbard
patent: 5313366 (1994-05-01), Gaudenzi et al.
patent: 5316787 (1994-05-01), Frankeny et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5377077 (1994-12-01), Burns
patent: 5394300 (1995-02-01), Yoshimura
patent: 5400904 (1995-03-01), Maston, III et al.
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5418688 (1995-05-01), Hertz et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5479318 (1995-12-01), Burns
patent: 5492223 (1996-02-01), Boardman et al.
patent: 5498906 (1996-03-01), Roane et al.
patent: 5514907 (1996-05-01), Moshayedi
patent: 5570274 (1996-10-01), Saito et al.
patent: 5575688 (1996-11-01), Crane, Jr.
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5634821 (1997-06-01), Crane, Jr.
patent: 5656856 (1997-08-01), Kweon
patent: 5677569 (1997-10-01), Choi et al.
patent: 5701233 (1997-12-01), Carson et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5742097 (1998-04-01), Matsunaga et al.
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5744862 (1998-04-01), Ishii
patent: 5754408 (1998-05-01), Derouiche
patent: 5757079 (1998-05-01), McAllister et al.
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5790378 (1998-08-01), Chillara
patent: 5798014 (1998-08-01), Weber
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5869353 (1999-02-01), Levy et al.
patent: 5869356 (1999-02-01), Fuller, Jr. et al.
patent: 5910885 (1999-06-01), Gulachenski et al.
patent: 5982633 (1999-11-01), Jeansonne
patent: 6014316 (2000-01-01), Eide
patent: 6028352 (2000-02-01), Eide
patent: 6038132 (2000-03-01), Tokunga et al.
patent: 6049972 (2000-04-01), Link et al.
patent: 6072122 (2000-06-01), Hosoya
patent: 6081429 (2000-06-01), Barrett
patent: 6084293 (2000-07-01), Ohuchi
patent: 6084780 (2000-07-01), Happoya
patent: 6093249 (2000-07-01), Curtin
patent: 6097086 (2000-08-01), Crane et al.
patent: 6101100 (2000-08-01), Londa
patent: 6107683 (2000-08-01), Castro et al.
patent: RE36916 (2000-10-01), Moshayedi
patent: 6160718 (2000-12-01), Vakilian
patent: 6214640 (2001-04-01), Fosberry et al.
patent: 6222739 (2001-04-01), Bhakta et al.
patent: 6262488 (2001-07-01), Masayuki et al.
patent: 6291259 (2001-09-01), Chun
patent: 6313522 (2001-11-01), Akram et al.
patent: 6313524 (2001-11-01), Pueschner et al.
patent: 6320757 (2001-11-01), Liu
patent: 6363846 (2002-04-01), Murakami
patent: 6388335 (2002-05-01), Lam
patent: 6404043 (2002-06-01), Isaak
patent: 6428650 (2002-08-01), Chung
patent: 6445591 (2002-09-01), Kwong
patent: 6462284 (2002-10-01), Hashimoto
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 6472735 (2002-10-01), Isaak
patent: 6559539 (2003-05-01), Tu et al.
patent: 6566746 (2003-05-01), Isaak et al.
patent: 6566760 (2003-05-01), Kawamura et al.
patent: 6577003 (2003-06-01), Crane et al.
patent: 6614110 (2003-09-01), Pace
patent: 6618267 (2003-09-01), Dalal et al.
patent: 6627984 (2003-09-01), Bruce et al.
patent: 6628527 (2003-09-01), Muramatsu et al.
patent: 6665194 (2003-12-01), Patel et al.
patent: 6683377 (2004-01-01), Shim et al.
patent: 6777798 (2004-08-01), Fukumoto et al.
patent: 6828666 (2004-12-01), Herrell et al.
patent: 6924556 (2005-08-01), Cha
patent: 2002/0088355 (2002-07-01), Comulada, Jr. et al.
patent: 2003/0122240 (2003-07-01), Lin et al.
patent: 2003/0137808 (2003-07-01), Kledzik et al.
patent: 2003/0168725 (2003-09-01), Wamer et al.
patent: 2003/0201526 (2003-10-01), Bolken et al.
patent: 198 45 316 (1999-02-01), None
patent: 0 714 231 (1996-05-01), None
patent: 08-051183 (1996-02-01), None
patent: 09-245926 (1997-09-01), None
patent: 10-074769 (1998-03-01), None
patent: 11-111914 (1999-04-01), None
patent: 2000-031617 (2000-02-01), None
patent: 2003-521806 (2003-07-01), None
patent: WO 00/35016 (2000-06-01), None
patent: WO 00/65652 (2000-11-01), None
patent: WO 00/68996 (2000-11-01), None
patent: WO 01/48819 (2001-07-01), None
patent: WO 01/69680 (2001-09-01), None
30(8) IBM Tech. Discl. Bull. 373-4 (1988).
Abrio Rhandee
Allee Greg
Bradbury-Bennett Julie Roslyn
Engle Jason
Kledzik Kenneth
Arbes Carl J.
Dewey & LeBoeuf LLP
Legacy Electronics, Inc.
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