Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Reexamination Certificate
2005-01-04
2005-01-04
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
C428S901000, C442S169000
Reexamination Certificate
active
06838164
ABSTRACT:
A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.
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Surface Mounting Technology, No. 1, pp 2-10; Kiyoshi Takagi, 1997 “Significant Trends, the Development of Buildup Multilayered PWBs”.
Nakamura Shinji
Nishii Toshihiro
Sakai Masayuki
Yamane Shigeru
Lam Cathy F.
Matsushita Electric - Industrial Co., Ltd.
Parkhurst & Wendel L.L.P.
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