Method and apparatus for evaluating and adjusting microwave...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06911837

ABSTRACT:
The present method includes steps of: discharging a droplet of fluid containing fine particles with electric characteristics from an inkjet nozzle onto the microwave integrated circuit formed on a substrate; forming a coat of the fine particles having electric characteristics on the substrate; measuring electric characteristics of the microwave integrated circuit using a probe of a circuit evaluation apparatus before and after forming the coat; and adjusting the electric characteristics of the microwave integrated circuit, so that forming the coat at a desired location on the upper surface of the circuit substrate by scanning an aim of the inkjet nozzle against the circuit substrate enables the microwave integrated circuit to meet the specification.

REFERENCES:
patent: 6113221 (2000-09-01), Weber
patent: 6544484 (2003-04-01), Kaufman et al.
patent: 2001/0039124 (2001-11-01), Shimoda
patent: 2001-274344 (2001-10-01), None
patent: 2002-134878 (2002-05-01), None
patent: 2002-324966 (2002-11-01), None
patent: 2003-86584 (2003-03-01), None
patent: 2003-133692 (2003-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for evaluating and adjusting microwave... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for evaluating and adjusting microwave..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for evaluating and adjusting microwave... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3514102

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.