Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2005-05-31
2005-05-31
Pert, Evan (Department: 2826)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
06900654
ABSTRACT:
Wire bond pad and solder ball or controlled collapse chip connections C4are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C4array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C4array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C4array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C4array is connected to the wire bond pads and either connection can be used to burn-in test the die.
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Danziger Steve M
Shah Tushar
BAE Systems - Information & Electronic Warfare Systems
Pert Evan
Snider Ronald R.
Snider & Associates
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