Method and apparatus for etching disk-like member

Details Method and apparatus for etching disk-like member Method and apparatus for etching disk-like member

2004-07-29

2009-02-24

Alanko, Anita K (Department: 1792)

Etching a substrate: processes

Planarizing a nonplanar surface

C216S083000, C216S090000, C216S091000, C216S092000, C134S001300, C134S003000, C134S026000, C134S033000, C134S094100, C134S137000, C134S902000, C156S345110

Reexamination Certificate

active

07494597

ABSTRACT:
Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).

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Chinese Office Action in related case with English translation, Aug. 24, 2007.

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