Method and apparatus for etching copper

Details Method and apparatus for etching copper Method and apparatus for etching copper

1984-01-19

1985-10-08

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204106, 204229, 204237, 204263, C25F 500, C25C 112, C25C 700, C25D 2118

Patent

active

045458774

ABSTRACT:
A method for etching copper metal from articles, such as printed circuit boards, by contacting the articles with an etchant solution containing cupric tetrammine ions at an etching station, transferring the etchant solution to a catholyte compartment only of an electrochemical cell in which dissolved copper is removed from the solution as copper metal by electrochemical reduction, and returning the etchant solution to the etching station. The invention also provides apparatus specifically adapted for carrying out the method, in which apparatus the electrochemical cell is adapted for the removal of copper from the etchant solution by electrochemical reduction, the cell including an ion exchange membrane to divide the cell into anode and cathode compartments.

REFERENCES:
patent: 4073708 (1978-02-01), Hicks, Jr.
patent: 4269678 (1981-05-01), Faul et al.
patent: 4385969 (1983-05-01), Kastening et al.
patent: 4468305 (1984-08-01), Hillis

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