Method and apparatus for etching a semiconductor wafer with feat

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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438711, 438713, 438720, 438734, 216 71, 156345, H01L 21302

Patent

active

061272779

ABSTRACT:
A method and apparatus provide for etching a semiconductor wafer using a two step physical etching and a chemical etching process in order to create vertical sidewalls required for high density DRAMs and FRAMs.

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