Electric heating – Metal heating – For bonding with pressure
Patent
1996-10-22
1999-05-11
Shaw, Clifford C.
Electric heating
Metal heating
For bonding with pressure
219 8519, B23K1/00
Patent
active
059024950
ABSTRACT:
Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
REFERENCES:
patent: 4441006 (1984-04-01), Machida et al.
patent: 4657169 (1987-04-01), Dostoomian et al.
patent: 4805830 (1989-02-01), Kawaguchi
patent: 5240165 (1993-08-01), Geyer et al.
patent: 5317125 (1994-05-01), Rossi
patent: 5386092 (1995-01-01), Dufrenne
patent: 5587091 (1996-12-01), Kawagoe et al.
patent: 5632912 (1997-05-01), Cecil
patent: 5645738 (1997-07-01), Cecil
Burke Edward J.
Henderson Donald Wesley
Lehman Lawrence Philip
Webster, deceased Daniel C.
Fraley Lawrence R.
International Business Machines - Corporation
Shaw Clifford C.
LandOfFree
Method and apparatus for establishing a solder bond to a solder does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for establishing a solder bond to a solder , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for establishing a solder bond to a solder will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-243991