Method and apparatus for equipping substrates with micropacks

Details Method and apparatus for equipping substrates with micropacks Method and apparatus for equipping substrates with micropacks

1986-11-03

1989-09-26

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29740, 29743, H01R 4300

Patent

active

048689785

ABSTRACT:
A method and apparatus for equipping micropacks on a substrate wherein the micropacks are supplied on a band from a supply reel and are cut from the band in a cut-out device. As the micropack is cut, a suction pipette or suction head of a positioning device engages the micropack as it is cut so that the orientation of the cut micropack is always known. The method and apparatus may include a bending or shaping of the external contacts of the micropack prior to the micropack being cut from the band.

REFERENCES:
patent: 4079489 (1978-03-01), Kowalski et al.
patent: 4236301 (1980-12-01), Hug et al.
patent: 4283839 (1981-08-01), Gursky
patent: 4399610 (1983-08-01), Moyer
patent: 4476626 (1984-10-01), Gumbert et al.

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